Advanced electronic packaging. (Record no. 41978)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 06633nam a2201489 i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 5263046 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | IEEE |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20191218152114.0 |
| 006 - FIXED-LENGTH DATA ELEMENTS--ADDITIONAL MATERIAL CHARACTERISTICS | |
| fixed length control field | m o d |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
| fixed length control field | cr |n||||||||| |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 100317t20152005nju o 000 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9780470544082 |
| Qualifying information | electronic |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| Canceled/invalid ISBN | 9780471466093 |
| Qualifying information | paper |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| Canceled/invalid ISBN | 0470544082 |
| Qualifying information | electronic |
| 024 7# - OTHER STANDARD IDENTIFIER | |
| Standard number or code | 10.1109/9780470544082 |
| Source of number or code | doi |
| 035 ## - SYSTEM CONTROL NUMBER | |
| System control number | (CaBNVSL)mat05263046 |
| 035 ## - SYSTEM CONTROL NUMBER | |
| System control number | (IDAMS)0b000064810c3195 |
| 040 ## - CATALOGING SOURCE | |
| Original cataloging agency | CaBNVSL |
| Language of cataloging | eng |
| Description conventions | rda |
| Transcribing agency | CaBNVSL |
| Modifying agency | CaBNVSL |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TK7874 |
| Item number | .A383 2005eb |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.381046 |
| Edition number | 22 |
| 245 00 - TITLE STATEMENT | |
| Title | Advanced electronic packaging. |
| 250 ## - EDITION STATEMENT | |
| Edition statement | 2nd ed. / |
| Remainder of edition statement | edited by William D. Brown, Richard K. Ulrich. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
| Place of production, publication, distribution, manufacture | Hoboken, New Jersey : |
| Name of producer, publisher, distributor, manufacturer | Wiley, |
| Date of production, publication, distribution, manufacture, or copyright notice | 2005. |
| 264 #2 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
| Place of production, publication, distribution, manufacture | [Piscataqay, New Jersey] : |
| Name of producer, publisher, distributor, manufacturer | IEEE Xplore, |
| Date of production, publication, distribution, manufacture, or copyright notice | 2009. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 1 PDF (784 pages). |
| 336 ## - CONTENT TYPE | |
| Content type term | text |
| Source | rdacontent |
| 337 ## - MEDIA TYPE | |
| Media type term | electronic |
| Source | isbdmedia |
| 338 ## - CARRIER TYPE | |
| Carrier type term | online resource |
| Source | rdacarrier |
| 490 1# - SERIES STATEMENT | |
| Series statement | IEEE press series on microelectronic systems ; |
| Volume/sequential designation | 1 |
| 500 ## - GENERAL NOTE | |
| General note | Previous ed.: New York: IEEE, 1999. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | List of Contributors. List of Acronyms. Preface. Introduction and Overview of Microelectronics Packaging (W. Brown). Microelectronics Packaging Materials and Applications (W. Brown). Electrical Design Considerations (S. Ang). Modeling and Simulation (L. Schaper). Thermal Design and Management of Electronics (R. Couvillion). Mechanical Design Considerations (W. Schmidt). Packaging Trade-Offs and Decisions (L. Schaper). Computer-Aided Engineering and Design (D. Andrews, et al.). Processing Technologies in Microelectronic Packaging (H. Naseem). Materials and Processing Considerations (S. Ang & W. Brown). Reliability Considerations (R. Ulrich). Testing and Qualification (S. Kolluru & D. Berleant). Mainframe Packaging: The Thermal Conduction Module (TCM) (T. Lenihan). An Industry Perspective on MCM-D (J. Demmin). Automotive Multichip Modules (R. Johnson & J. Evans). Analyticaln Techniques for Materials Characterization (S. Nasrazadani, et al.). Cost Considerations (E. Malstrom). Advances Topics and Future Trends in MCM Technology (J. Brewer, et al.). Index. About the Editor. |
| 506 1# - RESTRICTIONS ON ACCESS NOTE | |
| Terms governing access | Restricted to subscribers or individual electronic text purchasers. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc. | Packaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems. With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics. As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department. |
| 530 ## - ADDITIONAL PHYSICAL FORM AVAILABLE NOTE | |
| Additional physical form available note | Also available in print. |
| 538 ## - SYSTEM DETAILS NOTE | |
| System details note | Mode of access: World Wide Web |
| 588 ## - SOURCE OF DESCRIPTION NOTE | |
| Source of description note | Description based on PDF viewed 12/21/2015. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Microelectronic packaging. |
| 655 #0 - INDEX TERM--GENRE/FORM | |
| Genre/form data or focus term | Electronic books. |
| 695 ## - | |
| -- | Adhesives |
| 695 ## - | |
| -- | Assembly |
| 695 ## - | |
| -- | Automotive engineering |
| 695 ## - | |
| -- | Biographies |
| 695 ## - | |
| -- | Ceramics |
| 695 ## - | |
| -- | Clocks |
| 695 ## - | |
| -- | Complexity theory |
| 695 ## - | |
| -- | Computer aided engineering |
| 695 ## - | |
| -- | Computers |
| 695 ## - | |
| -- | Conductivity |
| 695 ## - | |
| -- | Conductors |
| 695 ## - | |
| -- | Cooling |
| 695 ## - | |
| -- | Costing |
| 695 ## - | |
| -- | Delay |
| 695 ## - | |
| -- | Design automation |
| 695 ## - | |
| -- | Dielectric materials |
| 695 ## - | |
| -- | Dielectrics |
| 695 ## - | |
| -- | Electromagnetic interference |
| 695 ## - | |
| -- | Electronic components |
| 695 ## - | |
| -- | Electronics packaging |
| 695 ## - | |
| -- | Engines |
| 695 ## - | |
| -- | Fabrication |
| 695 ## - | |
| -- | Face |
| 695 ## - | |
| -- | Failure analysis |
| 695 ## - | |
| -- | Finite element methods |
| 695 ## - | |
| -- | Force |
| 695 ## - | |
| -- | Gold |
| 695 ## - | |
| -- | Hardware design languages |
| 695 ## - | |
| -- | Heat transfer |
| 695 ## - | |
| -- | Heating |
| 695 ## - | |
| -- | Indexes |
| 695 ## - | |
| -- | Inductance |
| 695 ## - | |
| -- | Industries |
| 695 ## - | |
| -- | Integrated circuit interconnections |
| 695 ## - | |
| -- | Integrated circuit modeling |
| 695 ## - | |
| -- | Integrated circuit technology |
| 695 ## - | |
| -- | Integrated circuits |
| 695 ## - | |
| -- | Lattices |
| 695 ## - | |
| -- | Leg |
| 695 ## - | |
| -- | Logic gates |
| 695 ## - | |
| -- | Maintenance engineering |
| 695 ## - | |
| -- | Manufacturing |
| 695 ## - | |
| -- | Marketing and sales |
| 695 ## - | |
| -- | Materials |
| 695 ## - | |
| -- | Mechanical power transmission |
| 695 ## - | |
| -- | Metals |
| 695 ## - | |
| -- | Microassembly |
| 695 ## - | |
| -- | Microelectronics |
| 695 ## - | |
| -- | Multichip modules |
| 695 ## - | |
| -- | Noise |
| 695 ## - | |
| -- | Packaging |
| 695 ## - | |
| -- | Performance evaluation |
| 695 ## - | |
| -- | Pins |
| 695 ## - | |
| -- | Plastics |
| 695 ## - | |
| -- | Polyimides |
| 695 ## - | |
| -- | Powders |
| 695 ## - | |
| -- | Power distribution |
| 695 ## - | |
| -- | Production |
| 695 ## - | |
| -- | Reliability |
| 695 ## - | |
| -- | Resistance |
| 695 ## - | |
| -- | Scanning electron microscopy |
| 695 ## - | |
| -- | Scattering |
| 695 ## - | |
| -- | Shape |
| 695 ## - | |
| -- | Silicon |
| 695 ## - | |
| -- | Software |
| 695 ## - | |
| -- | Solid modeling |
| 695 ## - | |
| -- | Solids |
| 695 ## - | |
| -- | Strain |
| 695 ## - | |
| -- | Strain measurement |
| 695 ## - | |
| -- | Stress |
| 695 ## - | |
| -- | Substrates |
| 695 ## - | |
| -- | Surface topography |
| 695 ## - | |
| -- | Surface treatment |
| 695 ## - | |
| -- | Testing |
| 695 ## - | |
| -- | Thermal conductivity |
| 695 ## - | |
| -- | Thermal management of electronics |
| 695 ## - | |
| -- | Thermal stability |
| 695 ## - | |
| -- | Warranties |
| 695 ## - | |
| -- | Wire |
| 695 ## - | |
| -- | Wiring |
| 695 ## - | |
| -- | X-ray diffraction |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Brown, William D., |
| Dates associated with a name | 1943- |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Ulrich, Richard K. |
| Fuller form of name | (Richard Kevin), |
| Dates associated with a name | 1955- |
| 710 2# - ADDED ENTRY--CORPORATE NAME | |
| Corporate name or jurisdiction name as entry element | John Wiley & Sons |
| Relator term | publisher. |
| 710 2# - ADDED ENTRY--CORPORATE NAME | |
| Corporate name or jurisdiction name as entry element | IEEE Xplore (Online service), |
| Relator term | distributor. |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Relationship information | Print version: |
| International Standard Book Number | 9780471466093 |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE | |
| Uniform title | IEEE press series on microelectronic systems ; |
| Volume/sequential designation | 1 |
| 856 42 - ELECTRONIC LOCATION AND ACCESS | |
| Materials specified | Abstract with links to resource |
| Uniform Resource Identifier | https://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263046 |
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