Semiconductor memories : (Record no. 42055)

000 -LEADER
fixed length control field 05329nam a2201021 i 4500
001 - CONTROL NUMBER
control field 5264189
003 - CONTROL NUMBER IDENTIFIER
control field IEEE
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20191218152116.0
006 - FIXED-LENGTH DATA ELEMENTS--ADDITIONAL MATERIAL CHARACTERISTICS
fixed length control field m o d
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field cr |n|||||||||
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 151221s2002 njua ob 001 eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9780470546406
Qualifying information electronic
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
Canceled/invalid ISBN 9780780310001
Qualifying information print
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
Canceled/invalid ISBN 0470546409
Qualifying information electronic
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1109/9780470546406
Source of number or code doi
035 ## - SYSTEM CONTROL NUMBER
System control number (CaBNVSL)mat05264189
035 ## - SYSTEM CONTROL NUMBER
System control number (IDAMS)0b000064810c409f
040 ## - CATALOGING SOURCE
Original cataloging agency CaBNVSL
Language of cataloging eng
Description conventions rda
Transcribing agency CaBNVSL
Modifying agency CaBNVSL
050 #4 - LIBRARY OF CONGRESS CALL NUMBER
Classification number TK7895.M4
Item number S49 1997eb
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.39/732
Edition number 22
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Sharma, Ashok K.,
Relator term author.
245 10 - TITLE STATEMENT
Title Semiconductor memories :
Remainder of title technology, testing, and reliability /
Statement of responsibility, etc. Ashok K. Sharma.
264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE
Place of production, publication, distribution, manufacture Piscataway, New Jersey :
Name of producer, publisher, distributor, manufacturer IEEE Press,
Date of production, publication, distribution, manufacture, or copyright notice c1997.
264 #2 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE
Place of production, publication, distribution, manufacture [Piscataqay, New Jersey] :
Name of producer, publisher, distributor, manufacturer IEEE Xplore,
Date of production, publication, distribution, manufacture, or copyright notice [2002]
300 ## - PHYSICAL DESCRIPTION
Extent 1 PDF (xii, 462 pages) :
Other physical details illustrations.
336 ## - CONTENT TYPE
Content type term text
Source rdacontent
337 ## - MEDIA TYPE
Media type term electronic
Source isbdmedia
338 ## - CARRIER TYPE
Carrier type term online resource
Source rdacarrier
500 ## - GENERAL NOTE
General note "IEEE order number: PC3491"--P. [4] cover.
500 ## - GENERAL NOTE
General note "IEEE Solid-State Circuits Council, sponsor."
504 ## - BIBLIOGRAPHY, ETC. NOTE
Bibliography, etc. note Includes bibliographical references and index.
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note Preface -- Chapter 1: Introduction -- Chapter 2: Random Access Memory Technologies -- 2.1 Introduction -- 2.2 Static Random Access Memories (SRAMs) -- 2.3 Dynamic Random Access Memories (DRAMs) -- Chapter 3: Nonvolatile Memories -- 3.1 Introduction -- 3.2 Masked Read-Only Memories (ROMs) -- 3.3 Programmable Read-Only Memories (PROMs) -- 3.4 Erasable (UV)-Programmable Read-Only Memories (EPROMs) -- 3.5 Electrically Erasable PROMs (EEPROMs) -- 3.6 Flash Memories (EPROMs or EEPROMs) -- Chapter 4: Memory Fault Modeling and Testing -- 4.1 Introduction . . . -- 4.2 RAM Fault Modeling -- 4.3 RAM Electrical Testing -- 4.4 RAM Pseudorandom Testing -- 4.5 Megabit DRAM Testing -- 4.6 Nonvolatile Memory Modeling and Testing -- 4.7 IDDQ Fault Modeling and Testing -- 4.8 Application Specific Memory Testing -- Chapter 5: Memory Design for Testability and Fault Tolerance -- 5.1 General Design for Testability Techniques -- 5.2 RAM Built-in Self-Test (BIST) -- 5.3 Embedded Memory DFT and BIST Techniques -- 5.4 Advanced BIST and Built-in Self-Repair Architectures -- 5.5 DFT and BIST for ROMs -- 5.6 Memory Error-Detection and Correction Techniques -- 5.7 Memory Fault-Tolerance Designs -- Chapter 6: Semiconductor Memory Reliability -- 6.1 General Reliability Issues -- 6.2 RAM Failure Modes and Mechanisms -- 6.3 Nonvolatile Memory Reliability -- 6.4 Reliability Modeling and Failure Rate Prediction -- 6.5 Design for Reliability -- 6.6 Reliability Test Structures -- 6.7 Reliability Screening and Qualification -- Chapter 7: Semiconductor Memory Radiation Effects -- 7.1 Introduction -- 7.2 Radiation Effects -- 7.3 Radiation-Hardening Techniques -- 7.4 Radiation Hardness Assurance and Testing -- Chapter 8: Advanced Memory Technologies -- 8.1 Introduction -- 8.2 Ferroelectric Random Access Memories (FRAMs) -- 8.3 Gallium Arsenide (GaAs) FRAMs -- 8.4 Analog Memories -- 8.5 Magnetoresistive Random Access Memories (MRAMs) -- 8.6 Experimental Memory Devices -- Chapter 9: High-Density Memory Packaging Technologies.
505 8# - FORMATTED CONTENTS NOTE
Formatted contents note 9.1 Introduction -- 9.2 Memory Hybrids and MCMs (2-D) -- 9.3 Memory Stacks and MCMs (3-D) -- 9.4 Memory MCM Testing and Reliability Issues -- 9.5 Memory Cards -- 9.6 High-Density Memory Packaging Future Directions -- Index.
506 1# - RESTRICTIONS ON ACCESS NOTE
Terms governing access Restricted to subscribers or individual electronic text purchasers.
530 ## - ADDITIONAL PHYSICAL FORM AVAILABLE NOTE
Additional physical form available note Also available in print.
538 ## - SYSTEM DETAILS NOTE
System details note Mode of access: World Wide Web
588 ## - SOURCE OF DESCRIPTION NOTE
Source of description note Description based on PDF viewed 12/21/2015.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Semiconductor storage devices.
655 #0 - INDEX TERM--GENRE/FORM
Genre/form data or focus term Electronic books.
695 ## -
-- Arrays
695 ## -
-- Assembly
695 ## -
-- Built-in self-test
695 ## -
-- CMOS integrated circuits
695 ## -
-- CMOS technology
695 ## -
-- Capacitors
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-- Ceramics
695 ## -
-- Circuit faults
695 ## -
-- Clocks
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-- Complexity theory
695 ## -
-- Contamination
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-- Cosmic rays
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-- Decoding
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-- Dielectrics
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-- EPROM
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-- Earth
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-- Electron traps
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-- Electronics packaging
695 ## -
-- Ferroelectric films
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-- Films
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-- Indexes
695 ## -
-- Integrated circuit modeling
695 ## -
-- Ions
695 ## -
-- Latches
695 ## -
-- Lead
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-- Logic gates
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-- MOS devices
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-- Materials
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-- Nonvolatile memory
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-- Orbits
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-- Packaging
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-- Passivation
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-- Programming
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-- Protons
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-- Random access memory
695 ## -
-- Registers
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-- Reliability
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-- Satellites
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-- Shift registers
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-- Stress
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-- Substrates
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-- Testing
695 ## -
-- Transistors
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element John Wiley & Sons,
Relator term publisher.
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element IEEE Solid-State Circuits Council.
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element IEEE Xplore (Online service),
Relator term distributor.
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Relationship information Print version:
International Standard Book Number 9780780310001
856 42 - ELECTRONIC LOCATION AND ACCESS
Materials specified Abstract with links to resource
Uniform Resource Identifier https://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5264189

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