000			06633nam a2201489 i 4500
001			5263046
003			IEEE
005			20191218152114.0
006			m o d
007			cr |n|||||||||
008			100317t20152005nju o 000 0 eng d
020			_a9780470544082 _qelectronic
020			_z9780471466093 _qpaper
020			_z0470544082 _qelectronic
024	7		_a10.1109/9780470544082 _2doi
035			_a(CaBNVSL)mat05263046
035			_a(IDAMS)0b000064810c3195
040			_aCaBNVSL _beng _erda _cCaBNVSL _dCaBNVSL
050		4	_aTK7874 _b.A383 2005eb
082	0	4	_a621.381046 _222
245	0	0	_aAdvanced electronic packaging.
250			_a2nd ed. / _bedited by William D. Brown, Richard K. Ulrich.
264		1	_aHoboken, New Jersey : _bWiley, _c2005.
264		2	_a[Piscataqay, New Jersey] : _bIEEE Xplore, _c2009.
300			_a1 PDF (784 pages).
336			_atext _2rdacontent
337			_aelectronic _2isbdmedia
338			_aonline resource _2rdacarrier
490	1		_aIEEE press series on microelectronic systems ; _v1
500			_aPrevious ed.: New York: IEEE, 1999.
505	0		_aList of Contributors. List of Acronyms. Preface. Introduction and Overview of Microelectronics Packaging (W. Brown). Microelectronics Packaging Materials and Applications (W. Brown). Electrical Design Considerations (S. Ang). Modeling and Simulation (L. Schaper). Thermal Design and Management of Electronics (R. Couvillion). Mechanical Design Considerations (W. Schmidt). Packaging Trade-Offs and Decisions (L. Schaper). Computer-Aided Engineering and Design (D. Andrews, et al.). Processing Technologies in Microelectronic Packaging (H. Naseem). Materials and Processing Considerations (S. Ang & W. Brown). Reliability Considerations (R. Ulrich). Testing and Qualification (S. Kolluru & D. Berleant). Mainframe Packaging: The Thermal Conduction Module (TCM) (T. Lenihan). An Industry Perspective on MCM-D (J. Demmin). Automotive Multichip Modules (R. Johnson & J. Evans). Analyticaln Techniques for Materials Characterization (S. Nasrazadani, et al.). Cost Considerations (E. Malstrom). Advances Topics and Future Trends in MCM Technology (J. Brewer, et al.). Index. About the Editor.
506	1		_aRestricted to subscribers or individual electronic text purchasers.
520			_aPackaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems. With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics. As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
530			_aAlso available in print.
538			_aMode of access: World Wide Web
588			_aDescription based on PDF viewed 12/21/2015.
650		0	_aMicroelectronic packaging.
655		0	_aElectronic books.
695			_aAdhesives
695			_aAssembly
695			_aAutomotive engineering
695			_aBiographies
695			_aCeramics
695			_aClocks
695			_aComplexity theory
695			_aComputer aided engineering
695			_aComputers
695			_aConductivity
695			_aConductors
695			_aCooling
695			_aCosting
695			_aDelay
695			_aDesign automation
695			_aDielectric materials
695			_aDielectrics
695			_aElectromagnetic interference
695			_aElectronic components
695			_aElectronics packaging
695			_aEngines
695			_aFabrication
695			_aFace
695			_aFailure analysis
695			_aFinite element methods
695			_aForce
695			_aGold
695			_aHardware design languages
695			_aHeat transfer
695			_aHeating
695			_aIndexes
695			_aInductance
695			_aIndustries
695			_aIntegrated circuit interconnections
695			_aIntegrated circuit modeling
695			_aIntegrated circuit technology
695			_aIntegrated circuits
695			_aLattices
695			_aLeg
695			_aLogic gates
695			_aMaintenance engineering
695			_aManufacturing
695			_aMarketing and sales
695			_aMaterials
695			_aMechanical power transmission
695			_aMetals
695			_aMicroassembly
695			_aMicroelectronics
695			_aMultichip modules
695			_aNoise
695			_aPackaging
695			_aPerformance evaluation
695			_aPins
695			_aPlastics
695			_aPolyimides
695			_aPowders
695			_aPower distribution
695			_aProduction
695			_aReliability
695			_aResistance
695			_aScanning electron microscopy
695			_aScattering
695			_aShape
695			_aSilicon
695			_aSoftware
695			_aSolid modeling
695			_aSolids
695			_aStrain
695			_aStrain measurement
695			_aStress
695			_aSubstrates
695			_aSurface topography
695			_aSurface treatment
695			_aTesting
695			_aThermal conductivity
695			_aThermal management of electronics
695			_aThermal stability
695			_aWarranties
695			_aWire
695			_aWiring
695			_aX-ray diffraction
700	1		_aBrown, William D., _d1943-
700	1		_aUlrich, Richard K. _q(Richard Kevin), _d1955-
710	2		_aJohn Wiley & Sons _epublisher.
710	2		_aIEEE Xplore (Online service), _edistributor.
776	0	8	_iPrint version: _z9780471466093
830		0	_aIEEE press series on microelectronic systems ; _v1
856	4	2	_3Abstract with links to resource _uhttps://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263046
999			_c41978 _d41978