Tummala, R. R. Editor.
Microelectronics packaging handbook: Subsystem packaging. Part.3. - 2nd. Edition. - New York Chapman and Hall 1996 - xxix, 628p.
978-0-412-08451-5
Microelectronics packaging handbook: Subsystem packaging. Part.3. - 2nd. Edition. - New York Chapman and Hall 1996 - xxix, 628p.
978-0-412-08451-5