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Microelectronics packaging handbook: Subsystem packaging. Part.3. (Record no. 35670)

000 -LEADER
fixed length control field	00377nam a2200121Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field	160523s9999 xx 000 0 und d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number	978-0-412-08451-5
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name	Tummala, R. R. Editor.
245 ## - TITLE STATEMENT
Title	Microelectronics packaging handbook: Subsystem packaging. Part.3.
250 ## - EDITION STATEMENT
Edition statement	2nd. Edition.
260 ## - PUBLICATION, DISTRIBUTION, ETC.
Place of publication, distribution, etc.	New York
Name of publisher, distributor, etc.	Chapman and Hall
Date of publication, distribution, etc.	1996
300 ## - PHYSICAL DESCRIPTION
Extent	xxix, 628p.

Holdings
Withdrawn status	Lost status	Source of classification or shelving scheme	Damaged status	Not for loan	Permanent Location	Current Location	Date acquired	Full call number	Barcode	Date last seen	Price effective from	Koha item type	Public note
					International Institute of Information Technology Bangalore	International Institute of Information Technology Bangalore	2016-07-13	621.3810 TUM	511360	2023-12-21	2016-07-13	Reference	Reference

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