Sherwani, N. A.,
Routing in the third dimension : from VLSI chips to MCMs / Naveed A. Sherwani, Siddharth Bhingarde, Anand Panyam. - 1 PDF (xviii, 358 pages) : illustrations.
Includes bibliographical references (p. 335-350) and indexes.
Preface. Acknowledgments. Introduction. Graphs and Basic Algorithms. Channel Routing and Terminal Assignment. Routing Models. Basic Problems in Routing. Routing Algorithms for the Two-Layer Process. Routing Algorithms for the Three-Layer Process. Routing Algorithms for the Advanced Three-Layered Process. Routing Algorithms for Advanced VLSI and Thin-Film MCMs. Routing Algorithms for General MCMs. Bibliography. Author Index. Subject Index.
Restricted to subscribers or individual electronic text purchasers.
This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.
Mode of access: World Wide Web
9780470546376
10.1109/9780470546376 doi
Integrated circuits--Very large scale integration--Computer-aided design.
Multichip modules (Microelectronics)--Computer-aided design.
Electronic books.
TK7874.75 / .S48 1995eb
621.39/5
Routing in the third dimension : from VLSI chips to MCMs / Naveed A. Sherwani, Siddharth Bhingarde, Anand Panyam. - 1 PDF (xviii, 358 pages) : illustrations.
Includes bibliographical references (p. 335-350) and indexes.
Preface. Acknowledgments. Introduction. Graphs and Basic Algorithms. Channel Routing and Terminal Assignment. Routing Models. Basic Problems in Routing. Routing Algorithms for the Two-Layer Process. Routing Algorithms for the Three-Layer Process. Routing Algorithms for the Advanced Three-Layered Process. Routing Algorithms for Advanced VLSI and Thin-Film MCMs. Routing Algorithms for General MCMs. Bibliography. Author Index. Subject Index.
Restricted to subscribers or individual electronic text purchasers.
This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.
Mode of access: World Wide Web
9780470546376
10.1109/9780470546376 doi
Integrated circuits--Very large scale integration--Computer-aided design.
Multichip modules (Microelectronics)--Computer-aided design.
Electronic books.
TK7874.75 / .S48 1995eb
621.39/5