Microelectronics packaging handbook: Subsystem packaging. Part.3.
By: Tummala, R. R. Editor.
Material type: BookPublisher: New York Chapman and Hall 1996Edition: 2nd. Edition.Description: xxix, 628p.ISBN: 978-0-412-08451-5.Item type | Current location | Call number | Status | Notes | Date due | Barcode |
---|---|---|---|---|---|---|
Reference | 621.3810 TUM (Browse shelf) | Not for loan | Reference | 511360 |
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